Jan Kleinert from ESI will give a talk entitled, “Laser ablation of copper for microelectronics.”
Copper is one of the more common elements in the microelectronics industry. We review the broad existing and emerging approaches for copper laser ablation in the context of via drilling: from the MIR to UV, microsecond to femtosecond pulse widths, kHz to GHz repetition rates. Different beam shaping and steering techniques are used to optimize throughput, cost and quality. Modeling the hydrodynamics, thermodynamics and plasma physics behind these approaches quantitatively remains a challenge, but is making progress. We show some of our latest results.